With the trend of high performance and miniaturization of electronic equipment, Thermal Tape, as the core material of the thermal management system, is crucial to ensure the stable operation of components.
Thermal Tape is a thin material with high thermal conductivity and bonding function, usually in the form of pressure-sensitive adhesive (PSA). Its core function is to establish an efficient heat conduction path between electronic components and heat sinks, while providing reliable mechanical fixation, replacing traditional thermal grease or mechanical fasteners.
Why do we need Thermal Tape?
Efficient thermal conduction
Fill the microscopic air gap between components and heat sinks (air is a poor conductor of heat), significantly reducing the interfacial thermal resistance.
The thermal conductivity coefficient (k value) ranges from 0.5 to 6.0 W/mK, and high-performance models can reach more than 10 W/mK.
Integrated bonding and heat dissipation
Complete mechanical fixation and heat transfer at the same time, simplify the assembly process, and reduce production costs.
Avoid uneven application, drying or oil seepage of silicone grease, and improve long-term reliability.
Electrical insulation
Most Thermal Tapes have high dielectric strength (>3 kV/mm), which prevents short circuits and ensures circuit safety.
Ultra-thinness and adaptability
The thickness can be as low as 0.05mm, which is suitable for compact designs with limited space (such as mobile phones, tablets, and ultra-thin notebooks).
It can be attached to curved or irregular surfaces.
Solvent-free, low volatility
Meets the pollution-free process requirements of the electronics industry.
Thermal Tape's core application areas
Consumer electronics
Mobile phones/tablets: CPU, battery, display, backplane heat dissipation
Notebooks: SSD, GPU, VRM module bonding heat dissipation
LED lighting
Heat transfer from LED chips to aluminum substrates to extend the light decay life
Automotive electronics
Automotive grade requirements: ECU, headlights, BMS module heat dissipation (high temperature resistance, vibration resistance)
Network communication equipment
5G base station AAU, optical module, router chip heat dissipation
Industrial power supply
IGBT, MOSFET power device, and heat sink interface
Golden rule for selecting Thermal Tape
Clear thermal requirements
Calculate the power consumption (W) and allowable temperature rise (ΔT) of components, and reverse the required k value or thermal resistance value.
Electrical insulation requirements
Is it necessary to isolate high voltage? Confirm the breakdown voltage value (such as >3kV).
Space and thickness restrictions
Ultra-thin (<0.1mm) select graphene or phase change tape.
Environmental adaptability
Silicone is preferred for high-temperature environments (>150°C); high shear strength tape is required for vibration scenes.
Bonding surface characteristics
Low surface energy materials (such as PP plastics) require glue with high surface adaptability.
Thermal Tape has become a standard material for high-density electronic design with its unique value of integrated thermal management + structural fixation.
