Thermal conductive tape is a double sided pressure sensitive adhesive tape that provides preferential heat transfer between heat-generating components and cooling devices such as fans, heat sinks, or heat spreaders. It also serves as a thermal interface material for LEDs, power transistors, and other high-powered devices that can operate at temperatures above 100 deg C.
The conductive adhesive in the thermal tape combines pressure-sensitive adhesive with thermally conductive ceramic fillers to bond quickly and effectively to numerous substrates. It is available in many thicknesses and can be die-cut to bespoke designs.
A typical application of thermal tape is to mount LEDs, LED light bars, and other electronic components to troffer heat sinks for improved performance and durability. It can also be used to provide mechanical attachment to a heat sink for increased ease of assembly and to reduce assembly time.
There are a variety of factors to consider when selecting the right thermally conductive adhesive for your application. These include thermal properties, such as W/m-K and dielectric strength, and mechanical factors, including operating temperature range and substrate thickness.
Thermally conductive adhesive transfer tape is designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices such as fans, heat spreaders, or heat pipes. The tacky pressure-sensitive adhesive is loaded with thermally conductive ceramic fillers that do not require a heat cure cycle to form an excellent bond and act as a good thermal interface.
Thermally conductive adhesive tape is provided on a silicone-treated polyester release liner for easy handling and die cutting and has high adhesion, high conformability, and low volume resistance to flow to various substrates. Ideal for bonding to LSE (low surface energy) substrates and rough surfaces.
It is low thermal resistance and superior thermal conductivity enables it to be applied at extremely thin thicknesses to heat-generating devices and other low surface energy substrates.
Thermally conductive adhesive tape feature pressure-sensitive adhesives and are ideal for attaching electronics to heat sinks for improved performance and durability. They have an easy peel-and-stick application and can replace mechanical attachment hardware like springs and screws to decrease installation time.
When comparing heat-sinking compounds and tapes to thermal paste, the difference is primarily that these have much higher initial thermal conductivity and do not need a heat cycle to fully adhere. They also fill in air pockets between the heat source and heat sink, which is a crucial step for thermal transfer efficiency.
Choosing the best thermal interface for your application can be challenging, especially if you are unfamiliar with the product or the process. However, by considering the following important factors, it is possible to determine which is the best option for your needs.
